Wafer dicing is one of the processes popular in the semiconductor industry. It is just a way of separating a die from the wafer of semiconductor and this is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, through dicing blades.
‘Wafer dicing methods’
Scribing and breaking – usually is done in a substrate made of a brittle material by which good-quality cutting surface of the substrate can be achieved without any defects such as chippings on the substrate. This technique of semiconductor wafer separation is achieved by developing a stress in the wafer and fracturing the wafer across the stress line. A line should be created in the wafer surface across the street where in fact the break is desired.
Mechanical sawing – the procedure is done utilizing a mechanical machine called dicing saw; this method can be used for a micro electro-mechanical system semiconductor devices. While there are still yoursite.com that utilize this method, it really is slowly getting unpopular due to several disadvantages – the process is slow, contaminant-laden, and dependent on regular shapes.
Laser cutting – a new and more effective technology to cut semiconductor materials; the procedure functions by directing the output of a high-power laser at the material to be cut. This technique burns or vaporizes away the unwanted parts, leaving an edge with a high-quality surface finish.
As stated above, dicing blades are employed and are a significant element for the dicing process. There are various types of dicing blades and some of them will be the following:
Hubbed Nickel Bonded Blades – this is used to cut Silicon and III-V materials. This blade is ultra-thin and created using a special electrodepositing technique to hold the cutting diamonds in a nickel alloy matrix.
Hubbed Resin Bonded Blades – with this type of blade, there is no need to buy expensive flanges as the resinoid blade is permanently mounted to its own hub. As opposed to flanges, after the blade is dressed, it can be detached and reattached again without going right through the dressing process.
Hubless Resin Bonden Blades – this type of dicing blade performs extremely well on materials like ceramic, quartz, sapphire and glass. This may give minimum chipping and superior finish.
Metal Sintered Dicing Blades – that is a type of blade that is developed by capturing diamonds in a metal binder using sintering process – this is the very rigid blade and has a very low wear rates. These properties provide capability to create very straight cuts even though subjected to large exposures.